SmartStack® 200mm HWS Contactless Shipper

Technology is quickly shifting to a higher overall percentage of thinner and more sensitive wafers. The main driver behind the thinner, more sensitive wafers is the consumer electronics industries need for smaller, higher performing and lower cost device...

NEPCON Malaysia 2013

Do visit our booth #J09 at NEPCON Malaysia 2013 held in PISA (Penang International Sports Arena) from 10 to 12 June. Hope to see you there !...

Ex-stock Microelectronics packaging parts

A list of microelectronics packagaing items are available ex-stock for your selection, ranging from Chip trays/covers/clips, wafer carriers, VR trays to cleanroom tapes. Write to us or call us today for your requirement so that we can match it to the available stock...