SmartStack® 200mm HWS Contactless Shipper

Technology is quickly shifting to a higher overall percentage of thinner and more sensitive wafers. The main driver behind the thinner, more sensitive wafers is the consumer electronics industries need for smaller, higher performing and lower cost device...

NEPCON Malaysia 2013

Do visit our booth #J09 at NEPCON Malaysia 2013 held in PISA (Penang International Sports Arena) from 10 to 12 June. Hope to see you there !...