Wafer Handling Equipment
Silicon Connection provides NBS high-quality wafer packing/ unpacking equipment with sales support for our customers. The wafer handling equipment has a small footprint and ensure no ESD (electrostatic discharge) damage due to human handling the wafer.
NBS Wafer Packing WPC EVO
Collective 300mm wafer packing
- Automated systems for handling, sorting, packing, unpacking wafers
- Backside inspection – micro-cracks, peripheral breakages
- 125mm, 150mm, 200mm, 300mm wafer solutions
- HSMS/SECS/GEM/300mm communication
- Ultra-thin wafer handling
- 300mm, transferring wafers between FOUP/FOSB and HWS (Vice Versa)
WPC 200 Advance
Collective 200mm wafer packing
NBS WPC EVO
Provides the lowest cost of ownership process for automatically sorting, packing and unpacking wafers, without damage, with complete traceability.
WPC EVO automatically manages every step of the packing process including verification of each wafer handled and manipulation of all wafer packing materials.
WPC EVO is the smallest, safest, fastest and most reliable solution for your automated wafer storage and shipment needs.
300 mm automated wafer packing/unpacking/sorting equipment
We also provide quality dummy wafer to the semiconductor industry.