Cleaning & Reuse
Silicon Connection provides parts Cleaning Services for the products we sell such as wafer shippers, wafer cassettes, FOSB (Front-Opening Shipping Box) and FOUP (Front Opening Unified Pod). We also support customers’ Reuse Program with supply of selected products.
The parts go through aqeuous ultrasonic washing and are packed in class 100 cleanroom environment. Products after washing are then double sealed. Liquid Particle Count (LPC) and other laboratory analysis are available upon request.
For certain products which we are able to harvest from the secondary market, for example HWS (Horizontal Wafer Shippers), we can design for customers’ Reuse Program, or even offer a combination of new and used for sustainable supply.
Utilizing class 100 clean-room facility with aqueous ultrasonic cleaning, Silicon Connection is able to customize the cleaning process for customers’ FOUP, FOSB, Crystal-Pak®, Ultra-Pak®, Wafer Storage Boxes, Transport, Process Carriers and other critical parts cleaning.
Liquid Particle Count (LPC) and other laboratory analysis are available upon request.