Reference Materials
Read more about Our Microelectronics Packaging Products
Vacuum Release (VR) Product Series Carrier
Gel-Pak’s Vacuum Release Carrier is extremely versatile for fragile devices during shipping, handling and processing; Ideal for high-volume pick and place applications.
Gel-Pak Technical Datasheet
Check here for dimensions on internal clearances and usable areas of your device residing in Gel-Pak’s Gel-Box/ Gel-Tray/ Vacuum Release Tray.
VERTEC® Bumped Die Carrier Film (GP-BMP3E)
Preliminary Product Datasheet – Gel-Pak’s ideal solution for bumped die, flip chip and BGA handling.
Wafer Cassette Selection
An Essential Guide for Semiconductor Users.
Bare Die Tray Catalog
Entegris Bare Die, Chip Scale and Wafer Scale Package Handling.
Graphene Dry Transfer (White Paper)
Gel-Pak’s PF film can be used in the micromechanical exfoliation & transfer of graphene.
198/192 Series 200 mm Wafer Transport Carriers
Entegris 198/192 series 200 mm wafer transport carriers address automation, contamination control, and productivity requirements for today’s 200 mm fabs.