Parts Cleaning & Inspection

Utilizing class 100 clean-room facility with aqueous ultrasonic cleaning, Silicon Connection is able to customize the cleaning process for customers’ FOUP, FOSB, Crystal-Pak®, Ultra-Pak®, Wafer Storage Boxes, Transport, Process Carriers and other critical parts cleaning.

Liquid Particle Count (LPC) & Ion Chromatography (IC) and other laboratory analysis are available upon request.

Wafer Backgrind and Dicing

Complementing with our sale of dummy and test wafers, Silicon Connection provides wafer back-grind and dicing services for customers.

Dicing & back-grind for 6″, 8″ and 12″ wafers

In additional, Silicon Connection also helps customers in providing Laser Marking, Clean-room Labeling and other Identification Services for PFA Cassettes, and Wafer Rings and other products we sold.

Particle-free, Residue-free Clean-room Labels

Laser Marking Services

Silicon Connection provide in house laser marking services for our wafer handling products, such as PFA/PEEK wafer cassettes.

We also mark graphite crucibles and other fab critical materials.

Do contact us for more details about our capabilities and the services we offer.